Low Dk & Low Df Adhesive Sheet AD-3379H
Suitable for high multilayering of high-frequency substrates.
●Dk=3.01 / Df=0.0019 @80GHz ●High resin fluidity and excellent circuit embedding properties ●Composite substrate with PTFE substrates or MPI substrates is possible ●Can be laminated at a relatively low temperature of 180°C due to thermosetting properties ●Suitable for skew prevention without including glass cloth ☆This material is for manufacturers of printed circuit boards.
- Company：利昌工業
- Price：Other
